Two-Layer Tungsten Deposition Process Which Improves Adhesion and Reduces Resistance
Tungsten coatings are commonly subject to high stress and low adhesion, and when manufacturers try to compensate for stress, it leads to an increase in resistivity. The Denton Vacuum team recently tested a new approach to coating tungsten thin films, in order to improve adhesion while achieving low resistivity.
In this technical white paper, we explore:
- The challenges related to stress and resistivity in tungsten films
- A two-layer deposition method designed to address these challenges
- Results from this approach yielding tungsten films with no signs of cracking while maintaining low resistivity
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