---
title: Real-World Thin Film System Configurations for Compound Semi Applications
description: This use case details thin film system configurations for compound semiconductor applications, including IR imaging systems, laser diodes and RF power transistors.
---

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Use Case

## Real-World Thin Film System Configurations for Compound Semi Applications

![resource-thumb-compound-semi-use-case](https://info.dentonvacuum.com/hs-fs/hubfs/resource-thumb-compound-semi-use-case.png?width=300&name=resource-thumb-compound-semi-use-case.png)

Compound semiconductor manufacturers have several thin film deposition systems and tools to choose from in order to design the right configuration for their application. Depending on throughput and performance requirements, manufacturers can choose between deposition methods such as evaporation and sputtering, add on front-end options for faster production and utilize in-situ controls.

In this use case, we highlight possible thin film system configurations in the compound semi space, including:

- Long throw thermal evaporation, cryogenically cooled chuck and QCM for IR imaging systems
- A multi-cathode sputter module with a cassette load lock for laser diodes
- A four-chamber, dual load lock cluster tool and semiconductor-grade sputter module for RF power transistors

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