High-Volume, Cost-Effective Uniform Deposition for Flat and Curved Optical Surfaces
To achieve thin film uniformity on flat surfaces, nearly every conventional physical vapor deposition (PVD) method requires masking, complex motion, or both. However, a unique technology called inverted cylindrical magnetron (ICM) sputtering can achieve thickness uniformity on both flat and curved surfaces, without the use of masks and without lowering deposition rate.
In this technical white paper, we explore:
- The advantages of ICM sputtering over other PVD methods
- How ICM sputtering achieves uniformity for multilayer films on flat and curved surfaces
- Real-world data showing improved precision and thickness uniformity
Fill out the form to download the technical paper.