White Paper

Addressing Thin Film Challenges in High-Volume Compound Semiconductor Manufacturing: A 360‑Degree Approach

To scale into high-volume production, compound semiconductor manufacturers need to invest in a robust, reliable thin film deposition solution that is configured for high throughput and excellent precision. To achieve this, all facets of your configuration must be optimized for high-volume manufacturing while still prioritizing performance.

In this white paper, you’ll learn:

  • Why your complete thin film deposition system needs to be designed with high-volume production in mind, from your hardware and tools to your software package
  • What to look for in a cluster platform and software package to enable automation and efficiency
  • How the right partner with proven, reliable solutions and a wide range of thin film knowledge can help you ensure you’re maximizing performance and cost of ownership

Fill out the form to download the white paper.