4 Considerations for Indium Bump Deposition for Flip‑Chip Micro‑Array Image Sensing

Infrared (IR) imaging is widely used today across a number of different applications, including new adaptations such as focal plane arrays (FPAs). But higher density pixels are required to achieve maximum performance, so the distance between pixels is shrinking all the time. Indium bump deposition is the best method to achieve a high pixel density for IR imaging and FPAs.

This infographic outlines:

  • The necessary factors to achieving a high pixel density
  • Important considerations for using indium bump deposition and the results of each
  • Why indium is the best material to use for image sensing

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